Beijing, China (July 22, 2026) - Leading semiconductor device supplier GigaDevice (stock code: 603986.SH; 3986. HK) announced a strategic partnership with Neusoft Zhixing in response to industry needs. Both parties will rely on the innovative high-performance and high reliability automotive grade chips from Zhaoyi and the technological accumulation and mass production experience of Neusoft Zhixing in the field of on-board electronics. They will carry out in-depth cooperation in application areas such as intelligent cockpit, intelligent communication, central computing platform, integrated cabin, vehicle and parking, and regional controllers, jointly creating more competitive intelligent solutions in the market and promoting the upgrading of the automotive industry.

At present, as the automotive electronic and electrical architecture accelerates towards domain centralization and cross domain integration, deep cooperation between semiconductor companies and automotive component suppliers has become a key path to enhance the resilience of the vehicle supply chain and accelerate the landing of cutting-edge hardware. As a subsidiary of Neusoft Group in the field of intelligent vehicle interconnection, Neusoft Zhixing has a deep accumulation in intelligent cockpit, central computing platform and other fields, and has taken the lead in integrating AI big models into its product system. With excellent integrated development capabilities of "hardware+software+services", it has won the widespread trust of leading domestic and foreign car companies; Zhaoyi Innovation has been deeply rooted in the field of automotive electronics for many years, with a cumulative vehicle volume of over 450 million automotive grade Flash chips. At the same time, relying on high computing power, high security automotive grade MCUs and a complete product matrix, it has built a comprehensive and solid automotive chip underlying ecosystem. Based on this, deepening strategic cooperation between the two sides is not only a joint leap to complement each other's advantages and grasp the trend of industrial upgrading, but also an important measure to promote the technological evolution and ecological maturity of the automotive electronics industry.

According to the agreement, both parties will cooperate on three main levels: first, deepen the integration of automotive grade chips and applications, accelerate the deep adaptation and large-scale application of new automotive grade storage and MCU in the Neusoft Intelligent Vehicle Electronic Product Matrix, and release new collaborative efficiency; The second is to build a secure and reliable supply chain guarantee system, relying on the mature chip production capabilities of Zhaoyi Innovation and the market resources of Neusoft Zhixing, to enhance the response efficiency of the supply chain; The third is to promote industrial ecological cooperation and system construction. Both sides will jointly carry out chip access testing, connect high-quality resources upstream and downstream, and strive to build a new ecology of intelligent automotive industry that is safe, collaborative, and sustainable.



中国北京（2026年7月22日）——业界领先的半导体器件供应商兆易创新GigaDevice（股票代码：603986.SH；3986.HK）宣布与东软智行达成战略合作，回应产业之需。双方将依托兆易创新高性能、高可靠车规级芯片与东软智行在上车身电子全域的技术积累和量产经验，在智能座舱、智能通讯、中央计算平台、舱行泊一体、区域控制器等应用领域展开深度合作，共同打造更具市场竞争力的智能化解决方案，推动汽车产业的升级。

在汽车电子电气架构加速迈向域集中式与跨域融合的当下，半导体企业与汽车零部件供应商的深度合作，已成为提升整车供应链韧性、加速前沿硬件落地的关键路径。作为东软集团在智能汽车互联领域布局的子公司，东软智行在智能座舱、中央计算平台等领域拥有深厚积淀，并率先将AI大模型融入产品体系，凭借卓越的“硬件+软件+服务”一体化开发实力，赢得国内外头部车企的广泛信任；兆易创新在汽车电子领域深耕多年，其车规级Flash累计上车量超4.5亿颗，同时依托高算力、高安全性的车规级MCU及完善的产品矩阵，构建了全面且坚实的汽车芯片底层生态。基于此，双方深化战略合作，既是优势互补、把握产业升级趋势的携手跨越，也是推动汽车电子产业技术演进与生态成熟的重要举措。

根据协议，双方将围绕三大层面展开合作：一是深化车规芯片与应用融合，加速兆易创新车规级存储与MCU等在东软智行车载电子产品矩阵的深度适配与规模化应用，释放协同新效能；二是构建安全可靠的供应链保障体系，依托兆易创新成熟的芯片量产能力与东软智行的市场资源，提升供应链的响应效率；三是推动产业生态合作与体系共建，双方将联合开展芯片准入测试，打通上下游优质资源，致力于构建安全、协同、可持续发展的智能汽车产业新生态。




Jian Guodong, Senior Vice President of Neusoft Group and CEO of Neusoft Intelligence, said, "In today's continuous upgrading of automotive electronic and electrical architecture, high-performance automotive grade chips are a solid support for integrated software and hardware products. Zhaoyi's innovative automotive grade products have rich experience in mass production in the market. This cooperation will help break through traditional supply chain boundaries and jointly create more competitive, safe, resilient, and self evolving intelligent software and hardware solutions for automotive customers

Li Wenxiong, Vice President of Zhaoyi Innovation and General Manager of the Automotive Business Unit, said, "As a leading global provider of comprehensive solutions for intelligent vehicle body electronics, Neusoft Intelligent has a deep technical accumulation in system level integration, software and hardware collaboration, and other aspects. The strategic cooperation reached between the two sides is a deep handshake between semiconductor devices and vehicle intelligent system platforms. Both sides will fully leverage their respective advantages and jointly empower the high-quality development of the automotive industry

In the future, Zhaoyi Innovation and Neusoft Intelligence will take this strategic cooperation as an opportunity to closely follow the trend of electronic and electrical architecture transformation, and jointly promote the technological evolution and ecological co construction of the automotive electronics industry with a more solid hardware base and system level integration capabilities.



东软集团高级副总裁兼东软智行首席执行官简国栋表示："在汽车电子电气架构持续升级的今天，高性能的车规芯片是软硬一体化产品的坚实支撑。兆易创新的车规级产品在市场上拥有丰富的量产经验，此次合作，双方将有助于打破传统供应链边界，共同为车企客户打造更具市场竞争力、安全韧性和自我进化能力汽车智能化软硬一体解决方案。"

兆易创新副总裁、汽车事业部总经理李文雄表示："东软智行作为全球领先的智能汽车上车身电子全域解决方案提供商，在系统级整合、软硬协同等方面拥有深厚的技术积淀。此次双方达成战略合作，是半导体器件与车载智能化系统平台的一次深度握手。双方将充分发挥各自优势，共同为汽车产业高质量发展持续赋能。"

未来，兆易创新与东软智行将以此次战略合作为契机，紧跟电子电气架构变革趋势，以更加扎实的硬件底座与系统级整合能力，共同推动汽车电子产业的技术演进与生态共建。

(Using AI translation)

（使用AI翻译）