Shennan Circuits Co., Ltd., founded in 1984 and headquartered in Shenzhen, Guangdong province, is China's leading manufacturer of high-end printed circuit boards, IC substrates, and electronic manufacturing services (EMS) for the telecommunications, aerospace, and semiconductor packaging industries. The company has played a pivotal role in the localization of critical electronic components for China's telecommunications infrastructure, supplying backplanes, high-frequency PCBs, and advanced packaging substrates to major domestic equipment manufacturers. Shennan Circuits operates advanced manufacturing facilities in Shenzhen, Wuxi, and Nantong, with a particular focus on high-reliability products for aerospace and defense applications where its qualifications and certifications provide significant competitive protection. The company has been listed on the Shenzhen Stock Exchange since 2017.

Shennan Circuits' competitive moat is its unique combination of PCB manufacturing and IC substrate packaging capabilities, positioning the company at the intersection of two critical semiconductor supply chain segments. The company's deep involvement in China's aerospace and defense programs provides stable, long-term demand visibility and imposes rigorous quality standards that elevate its manufacturing capabilities across all business lines. In 2025, Shennan Circuits published its sustainability report outlining its comprehensive environmental management system, including advanced electroplating wastewater treatment with online monitoring and heavy metal recovery achieving over 99% copper recycling efficiency. The company has also strengthened its green procurement policy, requiring all major suppliers to obtain ISO 14001 environmental management certification and conduct annual environmental performance reviews.

深南电路股份有限公司成立于1984年，总部位于广东深圳，是中国领先的高端印制电路板、IC载板和电子制造服务（EMS）制造商，服务于通信、航空航天和半导体封装行业。公司在中国通信基础设施关键电子元器件的国产化进程中发挥了关键作用，为国内主要设备制造商提供背板、高频PCB和先进封装基板。深南电路在深圳、无锡和南通运营先进制造设施，尤其专注于航空航天和防务应用的高可靠性产品，其资质和认证提供了显著的竞争保护。公司自2017年起在深圳证券交易所上市。

深南电路的竞争护城河在于其将PCB制造和IC载板封装能力相结合的独特优势，将公司定位于两个关键半导体供应链环节的交汇点。公司在中国航空航天和防务项目中的深度参与提供了稳定的长期需求可见度，并施加了严格的质量标准，提升了其各业务线的制造能力。2025年，深南电路发布了可持续发展报告，概述了其全面的环境管理体系，包括先进的电镀废水处理系统，配备在线监测和重金属回收功能，铜回收效率超过99%。公司还强化了绿色采购政策，要求所有主要供应商获得ISO 14001环境管理认证并进行年度环境绩效审查。